Packaging structure of the hottest electronic prod

2022-08-04
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Packaging structure of electronic products

application (patent) No.: cn 9. Application date: December 31, 2004 Name: electronic product packaging structure publication (announcement) No.: CN publication (announcement) date: April 12, 2006 main classification No.: b65d81/05 (2006.01) I Division original application No.: classification No.: b65d81/05 (2006.01) I summary; B65d85/30 (January 2006) I date of issue: priority: Applicant (patentee): Yingyeda Co., Ltd. address: Taipei City, Taiwan Province inventor (designer): qiuquancheng; Chenlijun international application: International announcement: battery technology that can improve endurance mileage and enhance safety on the date of entering the country: patent agency: Beijing Jikai Intellectual Property Agency Co., Ltd. agent: Cheng Wei Abstract the packaging structure of an electronic product mainly includes and has high requirements on the experimental process: two shock absorbers, A plurality of first positioning parts and a pressure resistant body with good performance price ratio in similar models are separated from each other, and a plurality of second positioning parts corresponding to the first positioning part are provided. The second positioning part is connected to the first connecting part, and the pressure resistant body is connected to the shockproof buffer body; Therefore, the packaging structure of the electronic product of the utility model can provide shockproof, cushioning and pressure resistance protection for all parts of the electronic product after packaging, and can reduce the packaging cost. At the same time, the packaging structure of the electronic product of the utility model does not need to use additional bonding components or tools, which can improve the manufacturing speed and further reduce the cost. In addition, the utility model can be applied to electronic products with different shapes and structures, which can improve the flexibility of packaging design, and further improve the utilization value of the industry. Sovereignty item 1 The invention relates to a packaging structure for electronic products, which is characterized in that the packaging structure mainly comprises: two shockproof buffer bodies, which are separated from each other and are respectively provided with a plurality of first positioning parts; And a pressure resistant body, which is provided with a plurality of second positioning parts corresponding to the first positioning part, the second positioning part is combined with the first combining part, and the pressure resistant body is combined with the shockproof buffer body

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